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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
16-8400-310C Aries Electronics 16-8400-310C 10.0717
RFQ
ECAD 7084 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8400 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
24-6508-211 Aries Electronics 24-6508-211 19.8471
RFQ
ECAD 9680 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 24-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
10-0503-20 Aries Electronics 10-0503-20 4.9702
RFQ
ECAD 3184 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 10-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 10 (1 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
09-0518-11 Aries Electronics 09-0518-11 1.2474
RFQ
ECAD 9769 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 09-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 9 (1 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
12-1518-10 Aries Electronics 12-1518-10 1.1514
RFQ
ECAD 2352 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 12-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
16-8561-310C Aries Electronics 16-8561-310C 10.0717
RFQ
ECAD 4444 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8561 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
65-PGM10008-10 Aries Electronics 65-PGM10008-10 13.0289
RFQ
ECAD 4298 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 65-PGM1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
08-3518-11H Aries Electronics 08-3518-11H 2.8482
RFQ
ECAD 5799 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 08-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 49 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
44-3554-18 Aries Electronics 44-3554-18 153.9971
RFQ
ECAD 2914 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 44-3554 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
18-PRS15071-12 Aries Electronics 18-PRS15071-12 71.8567
RFQ
ECAD 9611 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 18-PRS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
16-8312-310C Aries Electronics 16-8312-310C 10.0717
RFQ
ECAD 4725 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8312 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
32-6572-16 Aries Electronics 32-6572-16 40.1775
RFQ
ECAD 7258 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 32-6572 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
28-6508-301 Aries Electronics 28-6508-301 13.5403
RFQ
ECAD 6042 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 28-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
10-2823-90 Aries Electronics 10-2823-90 7.2923
RFQ
ECAD 9407 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.2" (5.08mm) Row Spacing Closed Frame 10-2823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 10 (2 x 5) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
32-3513-10H Aries Electronics 32-3513-10H 9.4537
RFQ
ECAD 3430 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 32-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-0511-11 Aries Electronics 14-0511-11 14.5478
RFQ
ECAD 6210 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole SIP - 14-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (1 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
14-820-90T Aries Electronics 14-820-90T 8.9400
RFQ
ECAD 300 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-820 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
20-0517-90C Aries Electronics 20-0517-90C 7.3689
RFQ
ECAD 8008 0.00000000 Aries Electronics 0517 Bulk Active - Through Hole, Right Angle SIP - 20-0517 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Beryllium Copper - Brass 0.125" (3.18mm) -
15-PRS15068-12 Aries Electronics 15-PRS15068-12 71.3243
RFQ
ECAD 6135 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 15-PRS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
07-0503-30 Aries Electronics 07-0503-30 3.2320
RFQ
ECAD 2139 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 07-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 7 (1 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
42-6575-18 Aries Electronics 42-6575-18 155.2867
RFQ
ECAD 5274 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 42-6575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
44-3553-18 Aries Electronics 44-3553-18 153.9971
RFQ
ECAD 6336 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 44-3553 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
16-822-90T Aries Electronics 16-822-90T 7.7719
RFQ
ECAD 5738 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 16-822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
132-PLS14016-12 Aries Electronics 132-PLS14016-12 92.0320
RFQ
ECAD 5043 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 132-PLS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
10-8250-310C Aries Electronics 10-8250-310C 7.3114
RFQ
ECAD 4460 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 10-8250 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
196-PRS14001-16 Aries Electronics 196-PRS14001-16 -
RFQ
ECAD 1557 0.00000000 Aries Electronics PRS Bulk Obsolete -65°C ~ 200°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze 50.0µin (1.27µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
14-C280-00 Aries Electronics 14-C280-00 8.0598
RFQ
ECAD 2295 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-C280 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
03-7880-10 Aries Electronics 03-7880-10 7.5417
RFQ
ECAD 8866 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 03-7880 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 3 (1 x 3) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
18-0503-20 Aries Electronics 18-0503-20 8.7891
RFQ
ECAD 3982 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 18-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 18 (1 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
15-0511-11 Aries Electronics 15-0511-11 14.8963
RFQ
ECAD 8420 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole SIP - 15-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 15 (1 x 15) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse