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Embedded(605)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | SIC Programmable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
LPC18S50FET256551 | - |  |
3826 | 0.00000000 | NXP Semiconductors | LPC18xx | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | LPC18S50 | 256-LBGA (17x17) | download | 5A992C | 8542.31.0001 | 1 | 164 | ARM® Cortex®-M3 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | - | ROMless | - | 200K x 8 | 2.2V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | |||||||||||||||||
 |
MPC8255AVVPIBB | - | |
9998 | 0.00000000 | NXP Semiconductors | MPC82xx | Bulk | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | - | RoHS non-compliant | Vendor Undefined | 2156-MPC8255AVVPIBB-954 | 1 | PowerPC G2 | 300MHz | 1 Core, 32-Bit | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100Mbps (3) | - | - | 3.3V | - | I²C, SCC, SMC, SPI, UART/USART | |||||||||||||||||
|
MPC561CVR40 | - | |
8850 | 0.00000000 | NXP Semiconductors | - | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 388-BBGA | 388-PBGA (27x27) | - | 2156-MPC561CVR40 | 1 | 16 | PowerPC | 32-Bit | 40MHz | CANbus, EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | - | ROMless | - | 32K x 8 | 2.5V ~ 2.7V | A/D 32x10b SAR | External | |||||||||||||||||||
|
SCIMX538DZK1C | - | |
7011 | 0.00000000 | NXP Semiconductors | * | Bulk | Active | download | Vendor Undefined | REACH Unaffected | 2156-SCIMX538DZK1C-954 | 1 | ||||||||||||||||||||||||||||||||||
|
MPC565CZP56 | - | |
3591 | 0.00000000 | NXP Semiconductors | - | Bulk | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 388-BBGA | MPC565 | 388-PBGA (27x27) | - | RoHS non-compliant | Vendor Undefined | 2156-MPC565CZP56-954 | 3A991 | 8542.31.0001 | 1 | 56 | PowerPC | 32-Bit | 56MHz | CANbus, EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 36K x 8 | 2.5V ~ 2.7V | A/D 40x10b | External, Internal | ||||||||||||||
|
MPC860TCZQ50D4 | 150.8000 | |
3 | 0.00000000 | NXP Semiconductors | MPC86xx | Bulk | Obsolete | -40°C ~ 95°C (TJ) | Surface Mount | 357-BBGA | 357-PBGA (25x25) | - | 2156-MPC860TCZQ50D4 | 2 | MPC8xx | 50MHz | 1 Core, 32-Bit | Communications; CPM | DRAM | No | - | 10Mbps (4), 10/100Mbps (1) | - | - | 3.3V | - | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |||||||||||||||||||
|
MCIMX6U1AVM10AC | 48.1600 | |
600 | 0.00000000 | NXP Semiconductors | i.MX6S | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | 624-MAPBGA (21x21) | - | 2156-MCIMX6U1AVM10AC | 7 | ARM® Cortex®-A9 | 1GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | DDR3, DDR3L, LPDDR2 | Yes | HDMI, Keypad, LCD, LVDS, MIPI | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Bluetooth, CANbus, ESAI, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | |||||||||||||||||||
|
T1022NSE7WQB | - | |
4368 | 0.00000000 | NXP Semiconductors | QorIQ T1 | Bulk | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 780-FBGA, FCBGA | 780-FCPBGA (23x23) | - | RoHS non-compliant | Vendor Undefined | 2156-T1022NSE7WQB | 5A002 | 8542.31.0001 | 1 | PowerPC e5500 | 1.5GHz | 2 Core, 64-Bit | - | DDR3L, DDR4 | No | - | 1Gbps (5) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | DUART, eMMC/SD/SDIO, I²C, I²S, PCIe, SPI, UART | |||||||||||||||
 |
MK53DN512CMD10 | - | |
7985 | 0.00000000 | NXP Semiconductors | - | Bulk | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 144-LBGA | MK52DN512 | 144-LBGA (13x13) | - | RoHS non-compliant | Not Applicable | Vendor Undefined | 2156-MK53DN512CMD10 | 3A991 | 8542.31.0001 | 1 | 94 | ARM® Cortex®-M4 | 32-Bit | 100MHz | EBI/EMI, Ethernet, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 16b SAR; D/A 2x12b | Internal | Not Verified | ||||||||||||
|
S908QB4E0CDTE | 3.1700 | |
3 | 0.00000000 | NXP Semiconductors | HC08 | Bulk | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | S908 | 16-TSSOP | - | RoHS non-compliant | Vendor Undefined | 2156-S908QB4E0CDTE-954 | EAR99 | 8542.31.0001 | 1 | 13 | M68HC08 | 8-Bit | 8MHz | SCI, SPI | LVD, POR, PWM | 4KB (4K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 5.5V | A/D 10x10b SAR | Internal | ||||||||||||||
|
MPC860TCZQ66D4 | 226.6600 | |
3 | 0.00000000 | NXP Semiconductors | MPC86xx | Bulk | Obsolete | -40°C ~ 95°C (TJ) | Surface Mount | 357-BBGA | 357-PBGA (25x25) | - | 2156-MPC860TCZQ66D4 | 3A991A2 | 8542.31.0001 | 2 | MPC8xx | 66MHz | 1 Core, 32-Bit | Communications; CPM | DRAM | No | - | 10Mbps (4), 10/100Mbps (1) | - | - | 3.3V | - | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |||||||||||||||||
|
MC7457RX1000NC | 437.5700 | |
2 | 0.00000000 | NXP Semiconductors | MPC7457 | Bulk | Active | 0°C ~ 105°C (TA) | Surface Mount | 483-BCBGA, FCBGA | 483-FCCBGA (29x29) | - | 2156-MC7457RX1000NC | 1 | PowerPC G4 | 1GHz | 1 Core, 32-Bit | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | - | - | |||||||||||||||||||
|
S908GR8E0CDWE | 7.2800 | |
320 | 0.00000000 | NXP Semiconductors | HC08 | Bulk | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | S908 | 28-SOIC | - | RoHS non-compliant | Vendor Undefined | 2156-S908GR8E0CDWE | EAR99 | 8542.31.0001 | 1 | 21 | HC08 | 8-Bit | 8MHz | SCI, SPI | LVD, POR, PWM | 7.5KB (7.5K x 8) | FLASH | - | 384 x 8 | 2.7V ~ 5.5V | A/D 6x8b SAR | Internal | ||||||||||||||
|
MVF50NS152CMK40 | 25.9000 | |
90 | 0.00000000 | NXP Semiconductors | - | Bulk | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 364-LFBGA | 364-LFBGA (17x17) | download | RoHS non-compliant | Vendor Undefined | 2156-MVF50NS152CMK40 | 5A002 | 8542.31.0001 | 1 | ARM® Cortex®-A5 | 400MHz | 1 Core, 32-Bit | ARM® Cortex®-M4, Multimedia; NEON™ MPE | DDR3, DRAM, LPDDR2 | Yes | DCU, GPU, LCD, VideoADC, VIU | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (1) | 3.3V | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG | CANbus, I²C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | |||||||||||||||
|
MC9S08QD2VSC | - | |
7615 | 0.00000000 | NXP Semiconductors | S08 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | - | RoHS non-compliant | Vendor Undefined | 2156-MC9S08QD2VSC-954 | 1 | 4 | HCS08 | 8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 2KB (2K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 5.5V | A/D 4x10b SAR | Internal | |||||||||||||||||
|
MCF51QE96CLH557 | 7.3700 | |
800 | 0.00000000 | NXP Semiconductors | - | Bulk | Active | - | 2156-MCF51QE96CLH557 | 41 | ||||||||||||||||||||||||||||||||||||
|
MVF30NN151CKU26 | 24.4900 | |
720 | 0.00000000 | NXP Semiconductors | Vybrid, VF3xx | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-HLQFP (24x24) | - | 2156-MVF30NN151CKU26 | 13 | ARM® Cortex®-A5 | 266MHz | 1 Core, 32-Bit | ARM® Cortex®-M4, Multimedia; NEON™ MPE | DDR3, DRAM, LPDDR2 | Yes | DCU, GPU, LCD, VideoADC, VIU | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (1) | 3.3V | - | ||||||||||||||||||||
|
LS1028ACE7NQA | 89.2300 | |
90 | 0.00000000 | NXP Semiconductors | QorIQ® Layerscape | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 448-BFBGA | 448-FBGA (17x17) | - | 2156-LS1028ACE7NQA | 4 | ARM® Cortex®-A72 | 1.3GHz | 2 Core, 64-Bit | - | DDR3L, DDR4 | Yes | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | USB 3.0 (2) | - | Secure Boot, TrustZone® | CANbus, I²C, SPI, UART | |||||||||||||||||||
|
S912XDG128F2MAL | - | |
8558 | 0.00000000 | NXP Semiconductors | S12XD | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | 112-LQFP (20x20) | - | RoHS non-compliant | Vendor Undefined | 2156-S912XDG128F2MAL-954 | 1 | 91 | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 12K x 8 | 3.15V ~ 5.5V | A/D 16x10b SAR | External, Internal | |||||||||||||||||
 |
MPC8250AVVMHBC | - | |
6826 | 0.00000000 | NXP Semiconductors | MPC82xx | Bulk | Obsolete | 0°C ~ 105°C (TJ) | Surface Mount | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | - | RoHS non-compliant | Vendor Undefined | 2156-MPC8250AVVMHBC-954 | 3A991 | 8542.31.0001 | 1 | PowerPC G2 | 266MHz | 1 Core, 32-Bit | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100Mbps (3) | - | - | 3.3V | - | HDLC/SDLC, I²C, SCC, SMC, SPI, TDM, UART, USART | |||||||||||||||
|
LPC11U24FHI33/301, | 2.7500 | |
278 | 0.00000000 | NXP Semiconductors | LPC11U2x | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | - | 2156-LPC11U24FHI33/301, | 110 | 26 | ARM® Cortex®-M0 | 32-Bit | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | 32KB (32K x 8) | FLASH | 2K x 8 | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b SAR | Internal | |||||||||||||||||||
|
KK65FN2M0CAC18R | 65.6700 | |
2649 | 0.00000000 | NXP Semiconductors | K65 | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 169-UFBGA, WLCSP | KK65FN2 | 169-WLCSP (5.63x5.5) | - | ROHS3 Compliant | 1 (Unlimited) | REACH info available upon request | 2832-KK65FN2M0CAC18R | 3A991A2 | 8542.31.0000 | 1 | 116 | ARM® Cortex®-M4F | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 2MB (2M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 2x16b; D/A 2x12b | Internal | |||||||||||||
|
MC908GZ32MFAE | - | |
4945 | 0.00000000 | NXP Semiconductors | HC08 | Bulk | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | MC908 | 48-LQFP (7x7) | - | RoHS non-compliant | Vendor Undefined | 2156-MC908GZ32MFAE | 3A991 | 8542.31.0001 | 1 | 37 | HC08 | 8-Bit | 8MHz | CANbus, SCI, SPI | LVD, POR, PWM | 32KB (32K x 8) | FLASH | - | 1.5K x 8 | 3V ~ 5.5V | A/D 24x10b SAR | Internal | ||||||||||||||
|
FS32K144HRT0CLHT | - | |
9916 | 0.00000000 | NXP Semiconductors | S32K | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-LQFP (10x10) | - | 2156-FS32K144HRT0CLHT | 1 | 89 | ARM® Cortex®-M4F | 32-Bit | 80MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A 1x8b | External, Internal | ||||||||||||||||||||
|
LPC1113JHN33/203E | - | |
2011 | 0.00000000 | NXP Semiconductors | LPC11xx | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | - | 2156-LPC1113JHN33/203E | 1 | 28 | ARM® Cortex®-M0 | 32-Bit | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 24KB (24K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 3.6V | A/D 8x10b SAR | Internal | |||||||||||||||||||
|
LPC11A13JHI33/201E | 2.6800 | |
580 | 0.00000000 | NXP Semiconductors | LPC11Axx | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | - | 2156-LPC11A13JHI33/201E | 112 | 28 | ARM® Cortex®-M0 | 32-Bit | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, POR, WDT | 24KB (24K x 8) | FLASH | 2K x 8 | 6K x 8 | 2.6V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | |||||||||||||||||||
|
LPC2294HBD144/01,5 | - | |
4544 | 0.00000000 | NXP Semiconductors | - | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | 144-LQFP (20x20) | - | 2156-LPC2294HBD144/01,5 | 1 | 112 | ARM7TDMI-S | 16/32-Bit | 60MHz | CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 16K x 8 | 1.65V ~ 1.95V, 3V ~ 3.6V | A/D 8x10b SAR | Internal | |||||||||||||||||||
 |
S912XEG384F0CAL | - | |
6959 | 0.00000000 | NXP Semiconductors | - | Bulk | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | - | RoHS non-compliant | Vendor Undefined | 2156-S912XEG384F0CAL-954 | 3A991 | 8542.31.0001 | 1 | 83 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 384KB (384K x 8) | FLASH | 4K x 8 | 24K x 8 | 1.72V ~ 1.98V | A/D 16x12b SAR | External, Internal | Not Verified | |||||||||||||
|
MPC8314EVRADDA | 43.7200 | |
36 | 0.00000000 | NXP Semiconductors | - | Bulk | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 620-BBGA Exposed Pad | 620-TEPBGA II (29x29) | - | RoHS non-compliant | Vendor Undefined | 2156-MPC8314EVRADDA | 5A002 | 8542.31.0001 | 1 | PowerPC e300c3 | 266MHz | 1 Core, 32-Bit | Security; SEC 3.3 | DDR, DDR2 | No | - | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | Cryptography, Random Number Generator | DUART, GPIO, HSSI, I²C, PCI, SPI, TDM | |||||||||||||||
|
SVF321R3K2CKU2 | 27.6800 | |
40 | 0.00000000 | NXP Semiconductors | - | Bulk | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | - | RoHS non-compliant | Vendor Undefined | 2156-SVF321R3K2CKU2 | 5A002 | 8542.31.0001 | 1 | ARM® Cortex®-A5, ARM® Cortex®-M4 | 266MHz, 133MHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | DDR3, LPDDR2 | No | DCU, GPU, LCD, VideoADC, VIU | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (1) | 3.3V | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | CANbus, I²C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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