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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
CC60L2031 | 30.2700 |  |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC60L2031 | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 363°F (184°C) | No-Clean | 20 AWG, 22 SWG | Leaded | ||||||||
 |
SMD291AX10T5 | 29.9500 | |
13 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMD291 | 0.077 lb (34.93 g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 5 | ||
 |
24-6040-9711 | 72.5500 | |
8 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 14 AWG, 16 SWG | Leaded | |||||
 |
386839 | - | |
9151 | 0.00000000 | Harimatec Inc. | 370 | Spool | Obsolete | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.032" (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||||
 |
26-5050-9602 | - | |
8113 | 0.00000000 | Kester Solder | AW | Bulk | Active | Wire Solder | 26-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 5 lbs (2.27kg) | 0.093" (2.36mm) | 361 ~ 420°F (183 ~ 216°C) | Acid Cored | 11 AWG, 13 SWG | Leaded | ||||||
 |
4866-227G | - | |
6213 | 0.00000000 | MG Chemicals | 4860 | Spool | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 2 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.040" (1.02mm) | 361°F (183°C) | No-Clean | 18 AWG, 19 SWG | Leaded | - | ||||||
 |
CC6001020P | 47.4100 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 1 lb (453.59 g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC6001020P | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 363°F (184°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||||
 |
NCSWLF.020 1LB | 88.3100 | |
2 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NCSW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | NCSWLF.0201LB | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | |||||
 |
70-4105-0919 | 221.9630 | |
8952 | 0.00000000 | Kester Solder | NP545 | Bulk | Active | Solder Paste | 70-4105 | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 24.69 oz (700g) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | Lead Free | 4 | ||||
 |
TS391SNL10 | 31.9500 | |
8 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391S | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
 |
SMD2140 | 104.9500 | |
1 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.008" (0.20mm) | 361°F (183°C) | - | - | Leaded | |||||
 |
24-7150-8802 | 75.1965 | |
1889 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-7150 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||
 |
SMD2215-25000 | 15.7900 | |
11 | 0.00000000 | Chip Quik Inc. | SMD2 | Jar | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.030" (0.76mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
 |
18-7000-0078 | 1.0000 | |
4810 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 18-7000 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99 (99) | Spool, 20 lbs (9.07kg) | 0.078" (1.98mm) | - | - | 12 AWG, 14 SWG | Lead Free | |||||
 |
25-9574-0654 | 315.3617 | |
3033 | 0.00000000 | Kester Solder | OR421 | Bulk | Active | Wire Solder | 25-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 lbs (1.81kg) | 0.062" (1.57mm) | 441°F (227°C) | Water Soluble | 14 AWG, 16 SWG | Lead Free | |||||
|
26-6040-0060 | - | |
1989 | 0.00000000 | Kester Solder | 44 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 5 lbs (2.27kg) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | ||||||
|
14-4060-0125 | 28.4552 | |
7540 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-14-4060-0125 | 1 | ||||||||||||||||||||||
|
24-6337-7618 | - | |
7614 | 0.00000000 | Kester Solder | 275 | Spool | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||||
 |
SMDSWLF.006 50G | 79.9900 | |
23 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | SMDSWLF.00650G | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1.76 oz (50g) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 34 AWG, 38 SWG | Lead Free | - | |||
 |
SMD3SW.020 8OZ | 46.3400 | |
3 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | ||||
 |
SMDIN100-S-1 | 34.0000 | |
6797 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Shot | SMDIN | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | In100 (100) | Bag, 1 oz (28g) | - | 315°F (157°C) | - | - | Lead Free | ||||||
|
14-7070-0040 | - | |
7087 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 14-7070 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Ag5 (95/5) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 430 ~ 473°F (221 ~ 245°C) | - | 18 AWG, 19 SWG | Lead Free | |||||
 |
70-1003-0510 | 112.9580 | |
9910 | 0.00000000 | Kester Solder | HydroMark 531 | Bulk | Active | Solder Paste | 70-1003 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | Water Soluble | - | Leaded | 3 | ||||
 |
24-6337-0010 | 63.3400 | |
253 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||
 |
796065 | 67.7900 | |
5176 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Active | Wire Solder | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 423°F (217°C) | No-Clean | 27 AWG, 28 SWG | Lead Free | - | |||||
 |
CCBLF22701031P | 58.9200 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-CCBLF22701031P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 440°F (227°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | ||||||||
|
70-1002-0310 | 146.0660 | |
4759 | 0.00000000 | Kester Solder | HydroMark 531 | Bulk | Active | Solder Paste | 70-1002 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn62Pb36Ag2 (62/36/2) | Jar, 17.64 oz (500g) | - | 354°F (179°C) | Water Soluble | - | Leaded | 3 | ||||
|
92-6337-9710 | - | |
5975 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | |||||
 |
92-7068-8801 | 146.4621 | |
5084 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 92-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | |||||
 |
24-9574-7619 | 75.5156 | |
1339 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 441°F (227°C) | No-Clean | 22 AWG, 23 SWG | Lead Free |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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