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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
727190 | - |  |
5419 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.022" (0.56mm) | 440 ~ 464°F (227 ~ 240°C) | No-Clean | 23 AWG, 24 SWG | Lead Free | - | ||||||
 |
SMD291SNLT7 | 69.9500 | |
1 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD291SNLT7 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.35 oz (10g), 5cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | 7 | ||||
|
04-0123-0000 | - | |
3799 | 0.00000000 | Kester Solder | - | Bulk | Obsolete | Bar Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Pb75Sn23Sb2 (75/23/2) | Bar, 1.66 lbs (750g) | - | - | - | - | Leaded | - | |||||
 |
24-7340-9713 | 103.6604 | |
2581 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-7340 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | |||||
 |
RC63L2020E | 36.6400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC63L2020E | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||||
 |
SMDCU100-S-16 | 24.0000 | |
4 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Shot | SMDC | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Cu100(100) | Bag, 1 lb (454g) | - | 1983°F (1084°C) | - | - | Lead Free | ||||||
 |
RC6001031P | 42.3800 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC6001031P | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 363°F (184°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | ||||||||
 |
WC6301020P | 48.8600 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6301020P | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 361°F (183°C) | Water Soluble | 24 AWG, 25 SWG | Leaded | ||||||||
 |
70-0403-0923 | 154.6210 | |
9442 | 0.00000000 | Kester Solder | EnviroMark™ 828 | Bulk | Active | Solder Paste | 70-0403 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | Lead Free | 4 | ||||
 |
392249 | 59.4600 | |
39 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Active | Wire Solder | 1.1 lbs (499 g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.064" (1.63mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | ||||||
 |
SMDSWLF.031 2OZ | 18.0200 | |
20 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.125 lb (56.7 g) | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | - | |||
 |
24-7070-0061 | 115.7501 | |
4053 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7070 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Ag5 (95/5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 430 ~ 473°F (221 ~ 245°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | |||||
 |
SMD2200-25000 | 16.3900 | |
2 | 0.00000000 | Chip Quik Inc. | SMD2 | Jar | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.024" (0.61mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
 |
24-6337-6417 | 64.5800 | |
50 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 361°F (183°C) | Water Soluble | 22 AWG, 23 SWG | Leaded | ||||
 |
1993881 | 143.6300 | |
8189 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 10 | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | |||||
 |
18-6337-0093 | - | |
6906 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 18-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 20 lbs (9.07kg) | 0.093" (2.36mm) | 361°F (183°C) | - | 11 AWG, 13 SWG | Leaded | |||||
|
716856 | - | |
9262 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 2.20 lbs (1kg) | 0.064" (1.63mm) | 440 ~ 464°F (227 ~ 240°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | - | ||||||
 |
70-0202-0519 | - | |
9990 | 0.00000000 | Kester Solder | EP256HA | Bulk | Active | Solder Paste | 70-0202 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn63Pb37 (63/37) | Cartridge, 24.69 oz (700g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||
 |
25-9574-7613 | - | |
8761 | 0.00000000 | Kester Solder | 275 | Bulk | Active | Wire Solder | 25-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 lbs (1.81kg) | 0.050" (1.27mm) | 441°F (227°C) | No-Clean | 16 AWG, 18 SWG | Lead Free | |||||
 |
24-5050-0069 | - | |
7709 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361 ~ 420°F (183 ~ 216°C) | Rosin Activated (RA) | 8 AWG, 10 SWG | Leaded | |||||
 |
24-7040-8846 | 102.2888 | |
3915 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-7040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3.5 (96.5/3.5) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 430°F (221°C) | No-Clean | 18 AWG, 19 SWG | Lead Free | |||||
|
24-6040-9713 | 58.7600 | |
39 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | |||||
|
24-7080-9703 | 162.6524 | |
5137 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Lead Free | |||||
 |
NC2SW.031 1LB | 38.7700 | |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | NC2SW.0311LB | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 20 AWG, 21 SWG | Leaded | |||||
 |
CWSN63 NCCW2.2 .015 | 56.1500 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN63 | - | - | - | - | RoHS non-compliant | 2757-CWSN63NCCW2.2.015 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.015" (0.38mm) | - | - | - | - | |||||||||
 |
CC6301062E | 41.5300 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC6301062E | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | ||||||||
|
ICB97110 | 7.6247 | |
2287 | 0.00000000 | Pimoroni Ltd | - | Bulk | Active | Solder Paste | - | - | - | download | Not Applicable | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Tube | - | 284°F (140°C) | No-Clean | - | Lead Free | - | ||||||||
 |
4885-227G | 50.5400 | |
7 | 0.00000000 | MG Chemicals | 4880 | Spool | Active | Wire Solder | 4885 | 0.5 lb (226.8 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.032" (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||
 |
T0051404399 | 20.0000 | |
1982 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051404399 | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | Spool, 3.53 oz (100g) | 0.031" (0.79mm) | - | No-Clean | - | Lead Free | |||||
 |
NC2SW.031 0.5OZ | 2.9400 | |
295 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC2SW.0310.5OZ | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 20 AWG, 21 SWG | Leaded |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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