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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
RASWLF.020 2OZ | 12.0500 |  |
7 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | 60 Months | Date of Manufacture | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0202OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.020" (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | ||||||
 |
16-5050-0125 | - | |
4885 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 16-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 5 lbs (2.27kg) | 0.125" (3.18mm) | 361 ~ 420°F (183 ~ 216°C) | - | 8 AWG, 10 SWG | Leaded | |||||
 |
24-7050-9744 | - | |
2967 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | 24-7050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 1 lb (454 g) | 0.010" (0.25mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Mildly Activated (RMA) | 30 AWG, 33 SWG | Lead Free | |||||
 |
SMDSWLF.031 1OZ | 11.3800 | |
25 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.062 lb (28.12 g) | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | - | |||
 |
6059 | 48.1800 | |
167 | 0.00000000 | GC Electronics | * | Bulk | Active | - | RoHS non-compliant | Vendor Undefined | REACH info available upon request | 2266-6059 | EAR99 | 8311.30.3000 | 1 | |||||||||||||||||
|
145077-1 | - | |
3124 | 0.00000000 | iFixit | - | Bulk | Active | Wire Solder | IF145 | - | - | - | - | Not applicable | Not Applicable | 1 | Sn99.3Cu0.7 (99.3/0.7) | Tube, 0.50 oz (14.17g) | 0.040" (1.02mm) | 446°F (230°C) | - | - | Lead Free | |||||||||
|
1405650 | 115.3820 | |
2003 | 0.00000000 | LOCTITE | WS300 | Bulk | Not For New Designs | Solder Paste | 6 Months | Date of Manufacture | 35.6°F ~ 46.4°F (2°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | - | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | Water Soluble | - | Lead Free | - | ||||||
 |
SMD291SNLT4 | 18.9900 | |
3 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 4 | |||
 |
92-7068-7643 | - | |
2267 | 0.00000000 | Kester Solder | 275 | Bulk | Active | Wire Solder | 92-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 18 AWG, 19 SWG | Lead Free | |||||
 |
NC3SWLF.031 0.5OZ | 5.5800 | |
23 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC3SW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC3SWLF.0310.5OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3.5 (96.5/3.5) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | - | |||||
|
24-4060-0069 | - | |
3859 | 0.00000000 | Kester Solder | 44 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Pb60Sn40 (60/40) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361 ~ 460°F (183 ~ 238°C) | Rosin Activated (RA) | 8 AWG, 10 SWG | Leaded | ||||||
|
24-7068-7608 | 118.4400 | |
33 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 27 AWG, 28 SWG | Lead Free | ||||||
 |
SMDIN100-S-16 | 365.4600 | |
4095 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Shot | SMDIN | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | In100 (100) | Bag, 1 lb (454g) | - | 315°F (157°C) | - | - | Lead Free | ||||||
 |
26-6337-0038 | - | |
1329 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 26-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 5 lbs (2.27kg) | 0.040" (1.02mm) | 361°F (183°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | |||||
 |
96-7068-8815 | - | |
6568 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 96-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 27 AWG, 28 SWG | Lead Free | |||||
|
1844641 | - | |
8268 | 0.00000000 | Harimatec Inc. | HF212 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | - | - | - | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 | Jar, 17.64 oz (500g) | - | 408 ~ 424°F (209 ~ 218°C) | No-Clean | - | Lead Free | - | - | |||||
|
16-7317-0125 | - | |
1621 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb88Sn10Ag2 (88/10/2) | Spool, 5 lbs (2.27kg) | 0.125" (3.18mm) | 514 ~ 570°F (268 ~ 299°C) | - | 8 AWG, 10 SWG | Leaded | ||||||
|
24-7068-1407 | 149.7424 | |
1514 | 0.00000000 | Kester Solder | 48 | Bulk | Active | Wire Solder | 24-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Lead Free | |||||
 |
SMD2SWLF.020 4OZ | 26.2500 | |
6 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | - | Lead Free | ||||
 |
70-1002-0311 | 175.2790 | |
2133 | 0.00000000 | Kester Solder | HydroMark 531 | Bulk | Active | Solder Paste | 70-1002 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn62Pb36Ag2 (62/36/2) | Cartridge, 21.16 oz (600g) | - | 354°F (179°C) | Water Soluble | - | Leaded | 3 | ||||
 |
24-6337-8806 | 76.9900 | |
219 | 0.00000000 | Kester Solder | 245 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | Leaded | ||||
|
24-7068-7607 | 112.7500 | |
100 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-7068 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | ||||
 |
7770680000 | - | |
2351 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 07-7068 | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 5 lbs (2.27kg) | - | 423 ~ 424°F (217 ~ 218°C) | - | - | Lead Free | - | ||||
|
14-6337-0125 | 38.1780 | |
3873 | 0.00000000 | Kester Solder | Solid Core Wire | Spool | Active | Wire Solder | 14-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361°F (183°C) | - | 8 AWG, 10 SWG | Leaded | ||||||
|
91-7012-9820 | - | |
9553 | 0.00000000 | Kester Solder | 296 | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 8.8 oz (250g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | - | |||||
 |
14-6040-0031 | - | |
9431 | 0.00000000 | Kester Solder | - | Spool | Obsolete | Wire Solder | 1 lb (453.59 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | KE1604 | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | - | 20 AWG, 22 SWG | Leaded | - | |||
 |
SMD291SNL15T4 | 20.9500 | |
10 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste, Two Part Mix | SMD291 | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 0.53 oz (15g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
|
SOLDER WIRE SAC0307-0.8 | 13.1600 | |
9218 | 0.00000000 | Olimex LTD | - | Bulk | Active | Wire Solder | - | - | - | - | - | - | ROHS3 Compliant | 1188-SOLDERWIRESAC0307-0.8 | 1 | Sn99Cu0.7Ag0.3 (99/0.7/0.3) | Spool | 0.031" (0.79mm) | 415 ~ 442°F (213 ~ 228°C) | No-Clean | - | Lead Free | ||||||||
 |
NC191LT50T5 | 27.9500 | |
9933 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LT50T5 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | - | 280°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 5 | ||
 |
NC191LTA15 | 10.9500 | |
12 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA15 | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Syringe, 0.53 oz (15g), 5cc | - | 279°F (137°C) | No-Clean | - | - | 4 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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